We use various types of methods for deposition of multilayer systems, mainly magnetron sputtering, e-beam evaporation and pulsed laser deposition. We mostly rely on cooperation with external partners.

For fabrication process we use DC magnetron sputtering of conducting materials (Al, Au, Ta, Ti) in pure Ar atmosphere to deposit conductors or in with an addition of O to deposit insulators. The Microsystems deposition tool consist of three-target UHV system with base pressure of 1e-7 mbar , load lock, rotating sample configuration on cooled stage.